Optispac is a leading provider of advanced ceramic and metal-glass hermetic packaging solutions for integrated circuits and microsystems. Our products serve a wide range of industries, including:
• Optical communications
• Power electronics
• Automotive electronics
• Infrared sensors
• Microwave communications
• Medical devices
• New energy
• Artificial intelligence (AI)
Optispac integrates research, development, production, and operation with a strong R&D and process management system. We specialize in:
• High-reliability ceramic/metal packages
• Independent design, development, and manufacturing
• Structural support and optoelectronic feedthroughs
• Hermetic sealing, thermal management, and environmental adaptability
Our packaging solutions provide customers with greater integration, structural reliability, and process optimization, significantly reducing the difficulty and threshold of advanced chip system integration.
Optispac continuously drives innovation in micro-assembly and micro-packaging, focusing on new materials and processes:
• Advanced materials: ceramics, aluminum-based composites, copper-based composites, CMC, CPC
• Soldering technologies: gold-tin, gold-germanium, tin-silver-copper, silver-copper
• Thermal & structural expertise: finite element analysis, mold design, and reliability simulation
• RF and microwave engineering: radio frequency modeling and cost-efficient design
Through years of scientific research and technical accumulation, Optispac has become an expert in delivering highly reliable, thermally adapted, and structurally robust packaging solutions.
At Optispac, our business values are founded on:
• Innovation – advancing materials, processes, and designs
• Competition – driving performance and cost efficiency
• Collaboration – building strong partnerships across industries